Our Double Side Polished (DSP) wafers are tailored to meet the customer’s process and product specific requirements. 

DSP wafers make an excellent platform for double-sided litography. Our DSP wafers have very good thickness uniformity and orientation accuracy, and first-rate crystal quality and homogeneity.
We also supply thin DSP wafers that are optimized for fast processing and cap wafers for anodic, eutectic, fusion and glass frit bonding as well as bulk-optimized wafers for alkali etching (e.g. KOH, TMAH). In capping, our wafers enable excellent bonding strength and hermetic sealing of MEMS structures. Wafers optimized for bulk micromachining ensure high accuracy of the sensing elements, stable quality and effective processing.   

DSP Wafer Specifications