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Single Side Polished (SSP) Wafers
Our customized Single Side Polished (SSP) wafers supply a perfect platform for Discrete&Analog applications, surface MEMS, capping etc.
With controlling crystal growing, it provides the foundation for our highly doped, low-resistivity wafers that enable extremely high performing power semiconductors.
Our red phosphorus wafers boast ultra-low resistivity values that reduce the on-resistance and power losses of low-voltage power MOSFETs.

SSP wafers specifications

 Growth Methods

 Cz, MCz

 Diameter

 150, 200mm

 Crystal Orientation

<100>, <110>, <111>, off-oriented

 N Type Dopants

 Arsenic, Phosphorus, Red Phosphorus

 P Type Dopants

 Boron

 Resistivity

 <1mOhm-cm up to over 5,000 Ohm-cm

 Backside Treatment

 Etched, Polyback, LTO, Polished

 

Our Single Side Polished (SSP) wafer in 200 mm diameter is compatible even with the most demanding process lines. It has excellent thickness and flatness capabilities. We also supply SSP wafers with non-standard thickness for special applications (6” 380-1300 µm; 8” 500-1500 µm).

 

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