Our sealing glass pastes are formulated to seal with a variety of substrate materials at peak firing temperature as low as 430°C, depending upon the application. The organic vehicle has been specially formulated to ensure complete binder burnout in the firing range of 280°C-360°C.  

• Hermetic sealing of wafer level MEMS packaging, automotive sensors and other micro-mechanical devices such as vibration sensors, yaw-rate sensors, and accelerometer sensors
• Sealing of silicon to metal devices and packages for pressure sensor applications