We offer a wide range of CMP slurries that are designed for the primary and secondary polishing of bare silicon wafers. Our CMP slurries achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space.
  
We also work with our customers to design custom polishing products with tailored properties required for our customers’ increasingly complex CMP process requirements.  

• Colloidal silica-based alkaline slurry
• Tunable Si removal rate
• High dilution rate up to 1:30
• Low defectivity
• Good Si wafer surface roughness
• Cost competitive