We offer a wide range of aqueous CMP slurries for silicon carbide substrates that are developed to achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity utilizing existing equipment and space.

 
SN12500 – Bulk Removal Slurry for Silicone Carbide Substrate Polishing Performance 
SN12500 SiC Bulk Polishing Slurry 
•Abrasive: Al2O3
•pH : 8 ~ 10
•1-kit package (oxidant inside)
•Recyclable
•Suba 800 like pad recommended
•Ra = 0.7 ~ 0.9 Å (AFM)
•No scratch (Laser Tech.)

SN12001 – Fine Polish Slurry for SiC Substrates Polishing Performance
SN12001 SiC Fine Polishing Slurry
• Abrasive: colloidal silica
• pH : 8 ~ 10
• 2-kit package, mix two parts before use
• Oxidant: add oxidant before use
• Recyclable
• Soft polishing pad recommended
• Ra = 0.6 ~ 0.7Å (AFM)