We offer a wide range of alumina-based CMP slurries for polishing reclaims wafers that provide a better polishing capability for complex hard films with high throughput. Ideal for mechanical polishing, our slurries have a good surface roughness that delivers low defectivity.

Our CMP slurries achieve optimal metal CMP removal rates and have an excellent shelf life, resulting in decreased cost of ownership and increased productivity using existing equipment and space.    

We also work with our customers to design custom polishing products with tailored properties required for our customers’ increasingly complex CMP process requirements.
 
SN8004 Reclaim Wafer CMP Slurry Characteristics
• Colloidal silica-based alkaline slurry
• High removal rates (RRs)
• High throughput
• Low defectivity
• Good surface roughness
• Excellent slurry stability and shelf-life