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Laser drilling and cutting machines for
Laser green ceramic processing machines are suitable for drilling vias or cutting rectangular or any other shape for cavities in to green ceramic tape. Fast processing speed and no tool wearing, makes laser processing very competitive compare to mechanical punching.
Two laser types sources are available; A fiber laser source for general green ceramic processing and a high power UV laser source for most demanding applications. State of the art laser sources, beam positioning systems and optics are installed in order to active defined and long term repeatable processing results.
Proven machine mechanics and tape handling, similar to our mechanical punching machines, makes them very competitive. Successful laser processing is material sensitive. Drilling or cutting transparent carrier film with mentioned laser sources, is not possible. If required, carrier film suitable for laser processing has to be used. Green ceramic tapes contains different ceramics and different organic, therefore we recommend to perform laser drilling or cutting test on particular material.


Features
• Fast procesing speed
• Suitable for drilling vias or cutting any shape in green ceramic sheets
• Two different laser sources available IR or UV laser
• High precision optics and beam positioning system ensures high accuracy
• Proven mechanics similar to punching machines 

Industries
MEMS LTCC HTCC PZT Ceramic Chip component