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Wafer Support System(WSS) For TSV
We provide thin Wafer Support System(WSS) that is used for TSV in semiconductor industry. It has superior bonding and de-bonding properties with high thermal resistance and high purity level after cleaning.
Application
• 3D TSV packaging for Semiconductor
• 3D TSV packaging for Semiconductor
Characteristics
• Non-pressurized Bonding
• Bonding / De-bonding (Mechanical) process: Under Room Temperature
• High thermal resistance Adhesive: 250°C
• Controlling squeeze out / void issue from Adhesive at back side process
• Can be applied high topography as C4 bump: >100 um
• Non-pressurized Bonding
• Bonding / De-bonding (Mechanical) process: Under Room Temperature
• High thermal resistance Adhesive: 250°C
• Controlling squeeze out / void issue from Adhesive at back side process
• Can be applied high topography as C4 bump: >100 um
Concept of the process
Industries
Semiconductor
TSV
Advanced Materials Corporation
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11F-PH, The AMC Tower, 222, Bongeunsa-ro, Gangnam-gu, Seoul, 06135, KoreaTEL : +82-2-526-5900|FAX : +82-2-526-5920
Privacy Policy
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